Plasma Enhanced Chemical Vapor Deposition (PECVD) is a process that deposits extremely smooth, adherent amorphous diamond hard alloy coatings in a highly vacuum environment. Compared to PVD processes, PECVD processes use deep plating power supplies, do not require cathode targets, and the workpiece does not need to rotate in the furnace chamber. This process is a clean, pollution-free, reliable, and multifunctional coating process.
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硬件简单 |
复合磁场设计 |
沉积速度快>1μm/h |
沉积温度低<200℃ |
涂层光滑 |
等离子体清洁产品 |
The Physical Vapor Deposition (PVD) technique refers to the process of vaporizing the surface of a material source (solid or liquid) into gaseous atoms or molecules, or partially ionizing into ions, using physical methods under vacuum conditions, and depositing a thin film with certain special functions on the substrate surface through a low-pressure gas (or plasma) process. PVD is one of the main surface treatment technologies.
High target material utilization reduce the cost of usage
High deposition rate
Excellent coating adhesion
Reduced droplet evaporation
High ionization rate (similar to Arc)
Tunable frequence and reverse pulse
Densification and surface smooth
Synchronized control with bias and arc
Excellent coating adhesion
Smooth surface, no microparticles
Low residual stress
High ionization rate
High density
High deposition rate
Smooth surface, no microparticles
Low residual stress
 Special designed magnetic field that surround the sample system evenly
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Excellent homogeneity of etching
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Good diffraction
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Tunable etching strength
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Etched modules are maintenance-free
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